RESIL DEEP MATERIALS Trademark (Class 17) — Send To Vienna Codification Status & Details

The current status of RESIL DEEP MATERIALS is "Send To Vienna Codification". It was filed on 30/09/2026 at CHENNAI in Class 17. Status may change over time as the application moves through examination, publication, opposition and registration stages.

RESIL DEEP MATERIALS is filed in Class 17, covering: INSULATING MATERIALS FOR USE IN THE ELECTRONICS INDUSTRY, ELECTRICAL INSULATING MATERIALS, ADHESIVE SEALANT FOR GENERAL USE, ADHESIVE SEALANT COMPOUNDS; SEALING COMPOUNDS; SEALING AND GASKET MATERIALS FOR ELECTRONIC COMPONENTS AND PRINTED CIRCUIT BOARDS, INSULATING AND PROTECTIVE INTERLAYER DIELECTRIC MATERIALS AND COATINGS FOR USE IN INTEGRATED CIRCUITS, SEMICONDUCTOR DEVICES, COMPUTER DISK DRIVES AND OTHER COMPUTER HARDWARE. PLASTIC COMPOSITE MATERIAL IN THE FORM OF POWDERS, LIQUIDS, AND PASTES FOR USE IN MANUFACTURING; SEMI-PROCESSED EPOXY RESINS; SEMI-PROCESSED SYNTHETIC POLYMERS; SEMI-PROCESSED SYNTHETIC RESINS; SEMI-PROCESSED RESINS; SEMI-PROCESSED POLYMERS IN PELLET FORM; SEMI-PROCESSED THERMOSET RESINS. THERMALLY CONDUCTIVE INSULATORS; THERMALLY CONDUCTIVE INSULATING MATERIALS, NAMELY THERMAL PADS, SHEETS, AND GAP-FILLING MATERIALS FOR ELECTRONIC COMPONENTS; PHASE CHANGE THERMAL INTERFACE MATERIAL FOR USE BETWEEN AN ELECTRONIC COMPONENT AND A HEAT SINK, TO PROMOTE THERMAL TRANSPORT THERE BETWEEN.

RESIL DEEP MATERIALS covers: INSULATING MATERIALS FOR USE IN THE ELECTRONICS INDUSTRY, ELECTRICAL INSULATING MATERIALS, ADHESIVE SEALANT FOR GENERAL USE, ADHESIVE SEALANT COMPOUNDS; SEALING COMPOUNDS; SEALING AND GASKET MATERIALS FOR ELECTRONIC COMPONENTS AND PRINTED CIRCUIT BOARDS, INSULATING AND PROTECTIVE INTERLAYER DIELECTRIC MATERIALS AND COATINGS FOR USE IN INTEGRATED CIRCUITS, SEMICONDUCTOR DEVICES, COMPUTER DISK DRIVES AND OTHER COMPUTER HARDWARE. PLASTIC COMPOSITE MATERIAL IN THE FORM OF POWDERS, LIQUIDS, AND PASTES FOR USE IN MANUFACTURING; SEMI-PROCESSED EPOXY RESINS; SEMI-PROCESSED SYNTHETIC POLYMERS; SEMI-PROCESSED SYNTHETIC RESINS; SEMI-PROCESSED RESINS; SEMI-PROCESSED POLYMERS IN PELLET FORM; SEMI-PROCESSED THERMOSET RESINS. THERMALLY CONDUCTIVE INSULATORS; THERMALLY CONDUCTIVE INSULATING MATERIALS, NAMELY THERMAL PADS, SHEETS, AND GAP-FILLING MATERIALS FOR ELECTRONIC COMPONENTS; PHASE CHANGE THERMAL INTERFACE MATERIAL FOR USE BETWEEN AN ELECTRONIC COMPONENT AND A HEAT SINK, TO PROMOTE THERMAL TRANSPORT THERE BETWEEN.

The exact word "RESIL DEEP MATERIALS" is already on record at the Indian Trademark Registry under Application No. 8034717. If you intend to use a similar mark for similar goods or services, you should conduct a comprehensive availability search and consult a trademark attorney before filing. Registerkaro offers a free availability check followed by professional filing.

Indian registered trademarks are valid for 10 years from the date of registration and can be renewed indefinitely in 10-year blocks. RESIL DEEP MATERIALS (App #8034717) is currently in status "Send To Vienna Codification" — renewal dates apply only after registration is granted.

If RESIL DEEP MATERIALS is in the "Advertised before Acceptance" or "Accepted & Advertised" stage, you have a 4-month window from publication in the Trade Marks Journal to file an opposition (Form TM-O) at the same Trade Marks Registry office. Grounds typically include prior rights, descriptiveness or bad faith. Registerkaro can prepare and file a Notice of Opposition for you.